Semiconductor Industry Network has learned that recently, new financing news has been received from companies including Zhongchuang Microelectronics, Yunhan Xingchi, Xizhi Technology, Silicon Vision Technology, Ousi Microelectronics, Hengliu Technology, Jingzhou Equipment, Bovidian Yuan, Dingneng Optoelectronics, Optoelectronics Pioneer Institute, and Zhongke Huasi. The details are as follows:
1.Zhongminimally invasive chip company successfully completes Pre-B round of financing
Recently, Zhongminimally invasive chip company successfully completed the Pre-B round of financing. This financing, led by Qingdao Guoxin and co invested by Yuanchuang Investment and Yunhui Capital, marks a new stage of development for Zhongwei Microelectronics in the research and industrialization of new power semiconductor devices.
As a leading power semiconductor device development enterprise in China, Zhongminimally invasive chip company is committed to the design, manufacturing, and sales of IGBT chips and high-end intelligent power module IPM. In the early stage of development, it obtained a strategic investment of over 10 million yuan from the Gaochuang Aohai Management Fund and quickly built factories, expanded production lines, and put into operation with capital support. Its products provide strong technical support and product solutions for household appliances, new energy, industrial frequency conversion and other fields with their excellent performance and reliability, and provide stable supply of high-end power modules for China's new energy and home appliance fields, further promoting the localization process of the industry and enhancing China's competitiveness in the global power semiconductor industry.
The high-end intelligent power module IPM manufacturing and power chip research and development project in Qingdao West Coast New Area is expected to have a total investment of nearly 1 billion yuan and an annual output value of 1.5 billion yuan. The first phase of the IPM production line with an annual output of 15 million pieces has been put into operation, which will provide stable supply of high-end power modules for China's new energy and home appliance fields, further promote the localization process of the industry, and enhance China's competitiveness in the global power semiconductor industry.
2.Yunhan Xingchi completes tens of millions of angel round financing
Recently, Beijing Yunhan Xingchi Laser Technology Co., Ltd. announced the completion of tens of millions of angel round financing, led by Zhongguancun Capital and followed by Shunxi Fund. This round of financing will mainly be used for capacity expansion, organizational upgrading, and new product research and development.
Established in November 2023, Yunhan Xingchi is an all solid state deep ultraviolet laser manufacturer specializing in laser research and development in the semiconductor chip field. Its products adopt an all solid state technology route, with a compact design concept, simple peripheral interfaces, and remote diagnostic capabilities. The founding team has been working together for many years and has been engaged in laser development since 2008. They have always adhered to the all solid state technology route and have developed multiple laser products that have gained market recognition and a good reputation. Based on over a decade of industry accumulation, the core team has strong comprehensive technical capabilities in areas such as optics, mechanics, electronics, computing, and control.
Yunhan Xingchi's products include three series: all solid state nanosecond green laser and all solid state quasi continuous ultraviolet picosecond laser, mainly serving wafer annealing and measurement scenarios for chip semiconductors. At present, we have obtained bulk orders from multiple industry-leading clients and achieved stable delivery.
3.Xizhi Technology completes angel+round financing
On August 21st, according to Qichacha, Xizhi Technology completed an angel+round of financing and added a new shareholder, Wanbang Digital Energy Co., Ltd.
Shareholder shares have also changed: 8 shares, including Suzhou Xizhi Dayuan Enterprise Management Center (Limited Partnership), Suzhou Xizhi Tongxie Enterprise Management Center (Limited Partnership), and Suzhou Xizhi Qicheng Enterprise Management Center (Limited Partnership), have decreased; Jiaxing SAIC Chuangyong Equity Investment Partnership Enterprise (Limited Partnership) saw an increase in shares; Newly added shareholder Wanbang Digital Energy Co., Ltd.
It is reported that Xizhi Technology is committed to becoming a world-class supplier of automotive grade power and power module components. Founded in 2017, it has completed 5 rounds of financing to date. Last time in June 2024, the company received approximately 100 million yuan in angel round+financing, led by Hillhouse Capital and Shangqi Capital. The post investment valuation reached 1.064 billion yuan. The company is laying out the third-generation semiconductor SiC/GaN, taking into account high-performance IGBT, focusing on plastic packaging routes, and compatible with standard module interfaces. In July of this year, Xizhi Technology announced on its official WeChat account that its first batch of automotive grade SiC plastic encapsulated power module mass-produced products were officially launched and put into production. At present, the product has received mass production orders from customers and will achieve large-scale production in the fourth quarter of this year.
4.Silicon Vision Technology completes A+round of financing
According to Qichacha, Suzhou Silicon Vision Technology Co., Ltd. has completed an A+round of financing, with the investor being Jiance Capital.
Silicon Vision Technology was founded in June 2021 and has completed 7 rounds of financing so far. The company focuses on the research and development, production, and service of high-end semiconductor wafer quantity detection equipment, and is committed to independently developing domestically produced electron beam imaging quantity detection equipment with completely independent intellectual property rights and meeting industry needs.
At present, the company's products mainly have two types, namely CDSEM key dimension measurement equipment and EBI electron beam defect detection equipment. The CDSEM critical dimension measurement equipment utilizes high-resolution low-voltage scanning electron microscopy technology to obtain nanoscale imaging of patterned wafers, enabling the measurement and monitoring of critical dimensions (CD) at photolithography and etching process sites during the I0 manufacturing process to ensure yield. It can cover mature processes above 28 nanometers and meet the measurement requirements of 6/8/12 inch silicon-based, silicon carbide, gallium nitride, sapphire and other substrates.
5.Ousiwei completes the first batch of delivery for tens of millions of Pre-A+round financing
Recently, Ousiwei, a dark horse in the automotive wireless SoC chip industry, completed the first batch delivery of tens of millions of Pre-A+round financing. It was invested by a fund jointly established by Jinding Capital and Kangxi Communication (688653), with multiple institutions following suit. Yunxiu Capital served as the financial advisor for this round of financing. The funds raised in this round of financing will be used to continue investing in the research and development of ultra wideband (UWB) and automotive millimeter wave radar chips, providing security guarantees for accelerating product mass production and implementation. In the current severe capital market environment, Ousiwei has gone against the tide and completed a total of over 100 million yuan in financing within six months. The Pre-A round of financing completed at the beginning of the year was led by Lihe Capital, with follow-up investment from Hefei Gaotou and Broadcom Integrated (603068). As of the completion of this delivery, Ousiwei has received strong support from multiple listed companies and industrial capital.
Founded in October 2020, Ousi Micro Invasive is a leading manufacturer specializing in the design of ultra wideband (UWB) and automotive millimeter wave radar SoC chips. The company has gathered a top SoC chip research and development team from top domestic and foreign chip design companies, with profound technical and automotive grade product experience. At present, OSMicroelectronics has mass-produced UWB SoC products covering various application scenarios such as IoT, mobile phones, and automobiles, and has received targeted and bulk shipments from multiple customers.
6.Hengliu Technology completes a new round of financing
Recently, Jiangsu Hengliu Technology Co., Ltd. (referred to as "Hengliu Technology") completed a new round of financing, jointly invested by Guofa Venture Capital, Dunxing Capital, and Nanhui Venture Capital. The funds will mainly assist Hengliu Technology in building a single-walled carbon nanotube mass production test line.
Hengliu Technology was established in December 2022, headquartered in Suzhou High tech Zone. The core team comes from the University of Tokyo in Japan. It is a company that specializes in single-walled carbon nanotube conductive agents, mastering key core technologies such as catalyst preparation and highly uniform dispersion of single-walled carbon nanotubes. At the same time, it has the research and development, production, sales, and service of high-end conductive agents such as superconducting carbon black and graphene.
It is reported that high-end conductive agents such as single-walled carbon nanotubes from Hengliu Technology can be widely used not only in silicon-based negative electrodes of lithium-ion batteries, but also in positive electrodes of lithium-ion batteries, which can significantly improve electrode adhesion, discharge power, energy density, and safety of lithium-ion batteries. At the same time, it is also applicable to the next generation of new energy batteries, whether they are solid-state batteries, sodium ion batteries, or hydrogen fuel cells. At the same time, with various excellent properties, this product can also be widely used in various products or materials such as conductive plastics, transparent conductive films, supercapacitors, conductive inks, high-strength "super fibers", etc. Its application areas cover new energy vehicles, 3C digital, semiconductors, photovoltaic power generation, aerospace and many other fields.
7.Jingzhou Equipment has completed tens of millions of yuan in Series B financing
Recently, Suzhou Jingzhou Equipment Technology Co., Ltd. (referred to as "Jingzhou Equipment") completed tens of millions of yuan in Series B financing, jointly entered by Zhongxing Capital and various industry partners, which is another important layout of Zhongxing in the field of wet process equipment in the key front of the pan semiconductor industry.
It is reported that Suzhou Jingzhou Equipment Technology Co., Ltd. is an advanced manufacturing enterprise that integrates process development, design, manufacturing, sales, and after-sales service. It provides high-end wet process equipment and process technology for the three major fields of flat panel displays, photovoltaics, and semiconductors. Its main products include high-precision cleaning, coating, development, etching, peeling, and other equipment, and synchronously extends intelligent data, green low-carbon and other supporting technical services. Its products include online waste liquid recovery systems, intelligent integration, and data analysis.
Zhongxing Capital News pointed out that Jingzhou Equipment is the only manufacturer in China that has the ability to supply large-sized wet production lines. It has made breakthroughs in multiple national key equipment projects and its current performance has further exploded. For over 10 years, Jingzhou Equipment has accumulated a deep understanding of semiconductor wet process technology. It entered the G2.5 generation line in 2012, broke through etching and stripping in 2016, developed in 2020, and went into full production in the 8.6 generation line in 2024. It has successively overcome key wet process equipment, especially in the national major special project of large-size Array segment yellow light coating track line, HF cleaning and other links, achieving the industry's first breakthrough. The company's performance in the past 24 years has further exploded with the expansion of display production. Currently, it is the main supplier of top manufacturers in the industry, and its penetration is expected to continue to expand in the future, completely replacing equipment from Germany, Japan, and South Korea.
8.Bo Video Yuan received a Series A financing of 130 million yuan
Recently, Bo Video Yuan announced the completion of a 130 million yuan Series A financing. This round is jointly invested by SMIC Juyuan, Beijing 5G Industry Fund, Jinfu, Beihang Investment, and old shareholder Longmafeng. This financing will directly support Bovidin's market expansion in high-performance cameras and sensors, accelerating its global business layout.
Beijing Bovidiyuan Technology Co., Ltd. is a supplier of high-performance machine vision core components. Bovidin has two research and development centers in Beijing, China and Yokohama, Japan, with technical expertise in hardware design, high-speed transmission, underlying algorithms, and optical design. The company currently has mature product lines such as intelligent 3D cameras, high-end 2D cameras, intelligent cameras, DLP industrial projectors, etc. Its products can widely empower industries such as semiconductors, new energy, consumer electronics, and automobiles.
It is reported that the breakthroughs in these technologies have made significant progress in various high-precision fields, including semiconductor front-end, back-end, display panel, SMT, lithium battery, 3C, etc., with particularly outstanding performance in the semiconductor field. Its products have been widely used in the fields of nano graphic wafer defect detection, nano non graphic wafer defect detection, Sic detection, wafer geometry measurement, critical dimension measurement, overlay measurement, macroscopic wafer defect detection, and DUV/EUV laser beam analysis.
9.Dingneng Optoelectronics completes angel round financing of nearly 100 million yuan
Recently, Hangzhou Dingneng Optoelectronics Technology Co., Ltd. (hereinafter referred to as "Dingneng Optoelectronics") announced that the company has completed an angel round financing of nearly 100 million yuan. This financing is jointly invested by Yuanjing Sequoia Carbon Neutrality Fund and Yuanjing Venture Capital. The funds will mainly be used to expand the R&D team, accelerate the R&D speed, continuously upgrade and iterate the MW/GW grade perovskite production line solution, and provide important support for the company's technological accumulation and market expansion.
It is reported that Dingneng Optoelectronics was established in February 2023 and is a high-end equipment manufacturing enterprise specializing in the research and development, production, sales, and service of perovskite equipment. The core technology team of the company has experience in manufacturing and delivering perovskite components for the first 600 × 1200mm pilot line and 1200 × 1300mm mass production line in China. Dingneng Optoelectronics has established a customized development system for the design, process debugging, independent research and development of core equipment, and related supporting equipment for multi size perovskite production lines such as 300 × 300mm, 600 × 1200mm, and 1200 × 2400mm. The company can provide Turnkey engineering solutions, line equipment, and core process unit equipment for perovskite production lines, including basic processes. Its core product line includes PVD magnetron sputtering equipment, PVD thermal evaporation coating equipment, slit coating equipment, vacuum crystallization equipment, laser line cutting, edge cleaning equipment, etc.
10.Shaanxi Optoelectronics Leading Institute completes hundreds of millions of yuan B-round financing
Recently, Shaanxi Optoelectronic Leading Institute Technology Co., Ltd. (referred to as "Optoelectronic Leading Institute") announced the completion of hundreds of millions of yuan in Series B financing. This round of financing is jointly invested by Xi'an Caijin Urban Renewal Fund, Xike Holdings, and Photon Strong Chain Fund. The funds will mainly be used for the comprehensive upgrade of the "Advanced Photonic Device Engineering Innovation Platform".
The Optoelectronic Pioneer Institute was established in October 2015 and is a common technology service platform focusing on photon technology. After 9 years of development, the Optoelectronics Leading Institute has established a public service platform for optoelectronic chips and an innovative platform for advanced photonic device engineering. It has played a key role in helping Shaanxi's photonic enterprises "cluster together" and "solve pain points" and "build nests to attract phoenixes", highlighting the value of the chain owner. In early July, the Optoelectronic Pioneer Institute signed a 28 year ultra long term loan agreement with the Shaanxi Branch of the National Development Bank, with a total amount of 500 million yuan, to jointly accelerate the upgrade of the "Advanced Photonic Device Engineering Innovation Platform".
Based on the top-level design of Shaanxi Province's "Chasing Light Plan", the advanced photonic device engineering innovation platform created by the Optoelectronic Leading Institute was officially launched in March 2023, focusing on providing pilot scale foundry services for gallium arsenide (GaAs) - based compound optoelectronic chips. As of the end of June 2024, the platform has reached intention service agreements with more than 30 well-known optoelectronic chip companies in the industry, including signing pilot OEM contracts with nearly 20 companies, providing over a hundred services in total. The Optoelectronics Leading Institute will comprehensively upgrade the advanced photonic device engineering innovation platform in 2024. On the one hand, the plan is to invest 220 million yuan to develop new and more reliable automotive grade laser chip process equipment, and to develop laser chip process technology for the field of vehicle mounted LiDAR, further enhancing the research and development and pilot production capabilities of compound optoelectronic chips; On the other hand, it is planned to invest 750 million yuan to supplement silicon photonics equipment and develop 130nm silicon photonics technology.
11.Zhongke Huasi completes tens of millions of Pre-A round financing
Suzhou Zhongke Huasi Semiconductor Technology Co., Ltd. (referred to as "Zhongke Huasi") recently completed tens of millions of yuan in Pre-A round financing, led by a fund jointly established by Jinding Capital and Lixin Micro. The funds will be used to accelerate the team building, product research and development, and market expansion at home and abroad of Zhongkehua Silicon.
Founded in April 2021, Zhongke Huasi is a leading enterprise specializing in the design and manufacturing of high-performance mixed signal LED matrix driver chips. We are committed to providing customers with high-performance and high reliability mixed signal LED matrix management solutions. We have been awarded titles such as "Jiangsu High tech Enterprise" and "Suzhou Gusu Leading Talent Plan". The main members of Zhongke Huasi come from top tier companies such as TI and Broadcom, with an average working experience of over 10 years.
It is reported that in the more than three years since its establishment, Zhongke Huasi has developed three major series of dozens of consumer, industrial and automotive products, which are widely used in local dimming screen display backlight systems, automotive matrix lighting systems, transparent display screen systems and other applications.
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