According to the official website of Samsung Electronics, on July 9th, Samsung Electronics announced that it will provide Japan's artificial intelligence company Preferred Networks with a one-stop semiconductor solution called Interpose Cube S (I-Cube S) using 2nm GAA technology and advanced 2.5D packaging technology.
It is reported that the 2.5D advanced packaging I-Cube S technology is a heterogeneous integrated packaging technology that improves interconnect speed and reduces package size by integrating multiple chips into one package.
The statement stated that Preferred Networks aims to leverage Samsung's leading foundry and advanced packaging products to develop powerful AI accelerators to meet the growing computing demands driven by generative AI.
After the first mass production of 3nm process nodes using GAA transistor structure in the industry, Samsung Electronics further improved performance and power efficiency, and successfully won orders for 2nm process, consolidating its leading position in GAA technology.
Based on this collaboration, Samsung Electronics and Preferred Networks plan to showcase groundbreaking AI chip solutions for the next-generation data center and generative AI computing market in the future.
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